Meeting Your Peers Engineers #3 ITEC – Redefining Semiconductor Manufactering

We’re organizing the 3rd Meeting Your Peers Engineers lunch event on Thursday November 28 at Noviotech Campus. Engineers from semiconductor companies in the region are welcome to join.

This time, ITEC will share more about their company, including Green laser technology for sustainable chip assembly and the eXtreme Assembly Lab. They are also sponsoring the lunch.

Joep Stokkermans, R&D Director ITEC
ITEC – “Redefining Semiconductor Manufacturing”
Headquartered in Nijmegen, the Netherlands, ITEC is a back-end semiconductor equipment manufacturer, specialized in high-volume production of semiconductors. ITEC is rooted in semiconductor manufacturing, combining over 30 years of state-of-the-art equipment and automation expertise as partner to Philips, NXP and Nexperia. In July 2021, ITEC became a separate legal entity to be able to address external markets and customers.

ITEC solutions
With an installed base of more than 2600 of the industry’s most advanced tools, ITEC is committed to embed the latest technologies and process expertise into tailored solutions that redefine manufacturing. ITEC enables its customers to excel in quality, productivity, and sustainability with the lowest total cost of ownership.
 
Jasper Wesselingh, Mechatronic Architect ITEC
Green laser technology for sustainable chip assembly
The chip assembly roadmap for high-volume production is largely determined by smaller chip sizes and reduced energy consumption per assembled chip. This talk will discuss how a shift from mechanical to laser based processes can enable this roadmap. We dive into the laser-assisted processes and show the steps from lab-scale experiments to prototype equipment.
 
Dr. Ir. Marcel Tichem, TU Delft
Associate Professor TU Delft, Department of Precision and Microsystems Engineering
Scientific program leader X.AL
 
X.AL – eXtreme Assembly Lab
Future chip assembly processes need to comply with challenging demands: achieving 10x higher throughput, handling die sizes well below 100µm, and reducing the environmental footprint. X.AL is a joint research programme of TU Delft and ITEC for establishing the technological foundation to meet these demands. Future assembly processes will be based on non- & soft-contact force fields to replace mechanical and contact-based chip assembly.
 

Program:

12:00 – 12:30     Walk in & Lunch

12:30 – 12:40     Presentation ITEC (Joep Stokkermans, R&D Director ITEC)

12:40 – 13:40     In-depth presentations:

• Green laser technology for sustainable chip assembly (Jasper Wesselingh, Mechatronic Architect ITEC)
• X.AL – eXtreme Assembly Lab (Dr. Ir. Marcel Tichem, TU Delft)

13:40 – 13:45     Wrap-up & End

Don’t miss this opportunity to network and expand your knowledge! Sign up quickly and reserve your spot on Nov 28. It will be an inspiring and valuable session that you won’t want to miss!